Film removal method and apparatus

ABSTRACT

A film removal method and apparatus for removing a film from a substrate are disclosed. The method comprises the steps of disposing a plasma generator and a sucking apparatus over the substrate, projecting a plasma beam from the plasma generator onto the film obliquely, disposing the sucking apparatus on a reflection path of plasma projected by the plasma generator, and sucking a by-product of an incomplete plasma reaction occurring to the film so as to keep a surface of the substrate clean, with a view to overcoming the drawbacks of deposition of the by-product which results from using the plasma as a surface cleansing means under atmospheric conditions.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for film removal and anapparatus thereof, and more particularly, to a method for removing afilm using plasma under atmospheric conditions and an apparatus thereof.

2. Description of the Prior Art

Processes of conventional liquid crystal display panels (TFT-LCD) entailswitching between a dry process and a wet process repeatedly. In orderto accelerate a process, panel manufacturers nowadays perform variousprocesses of TFT-LCD in a dry environment, but it is still necessary tosoak panels in photoresist strippers for removing photoresists.

Soaking a panel to remove a photoresist is followed by air-drying thepanel, which incurs high manufacturing costs and prolongs the process.In light of the demand for large panels, the aforesaid drawbacks arebecoming serious as panel size increases. In order to accelerate a panelprocess, some panel manufacturers remove photoresists by plasma.Plasma-based removal belongs to a dry process, thus a panel process canbe completely carried out at a dry environment. As regards the yield, aprocess which involves removing a photoresists by soaking thephotoresist-coated panel takes one hour to produce 75 pieces of panels.By contrast, the plasma-based photoresist removal process produces 100to 120 pieces of panels.

Nevertheless, the plasma-based photoresist removal process has to beperformed in a vacuum, and it entails continuously introducing gas and acatalyst in order to generate plasma. As a result, the yield increases,but so do the manufacturing costs.

In order to reduce the plasma production costs, Dainippon Screen Mfg.developed a technique whereby plasma is generated under atmosphericconditions to perform surface cleansing. Referring to FIG. 1A, anelectric-field bias is generated across electrode plates 1 a and 1 b andconfigured to induce a reactant, gas A, to generate plasma. Referring toFIG. 1A again, a substrate 10 passes between the two electrode plates 1a and 1 b and undergoes surface cleansing. The substrate 10 can be afabric to be dyed or a material to be surface-mounted. Alternatively,the substrate 10 can be a liquid crystal panel from which a photoresistis to be removed by plasma.

Nonetheless, subjecting a liquid crystal panel to an electric fieldusually damages electronic components mounted on the liquid crystalpanel. In this regard, Dainippon Screen Mfg. made the followingimprovements in the aforesaid atmospheric plasma-based surface cleansingtechnique. Referring to FIG. 1B which differs from FIG. 1B in that,instead of directly passing between the electrode plates 1 a and 1 b,the substrate 10 is disposed perpendicularly to the electrode plates 1 aand 1 b which cause plasma to be perpendicularly projected onto thesubstrate 10, and further, the substrate 10 is moved so as to react withthe plasma thoroughly. The aforesaid improvements are open-ended, as itis feasible to modularize a plasma generation device such that theplasma generation device is turned into a plasma jet, for example.

In a situation where the substrate 10 is a photoresist-coated liquidcrystal panel, plasma projected perpendicularly onto the liquid crystalpanel removes most of the photoresist. However, part of the photoresistfails to react with the plasma but forms a particulate by-product. Theby-product splashes and falls by gravity onto the panel, thus the panelyield is affected.

In order to solve the aforesaid drawbacks related to the by-product ofthe plasma reaction, some proposed installing a panel above a plasmagenerator for projecting plasma upwardly and vertically to the panelsuch that the splashed by-product spontaneously falls by gravity.Nevertheless, at a glance, the surfaces of liquid crystal panels areseemingly flat and smooth, they are full of plenty of microstructuresindeed. In this regard, projecting plasma perpendicularly to a panelreadily removes a photoresist from the fronts of the microstructures,but the perpendicularly projected plasma is unlikely to remove thephotoresist from the lateral surfaces of the microstructures thoroughly.In addition, with the demand for large panels increasing, it isextremely inconvenient to invert large panels during a process. Toalleviate the inconvenience, special hanging tools are designed tosecure the panels in position but prove unsatisfactory because of highcosts, not to mention that hanging large panels in the air is likely tobend the large panels. The aforesaid drawbacks also occur to U.S. Pat.No. 6,659,110 which discloses a method which involves disposing asubstrate on a roller for solving problems with a by-product of a plasmareaction.

Accordingly, an issue that needs an urgent solution is related toendeavors to overcome the aforesaid drawback.

SUMMARY OF THE INVENTION

In light of the aforesaid drawbacks of the prior art, it is a primaryobjective of the present invention to provide a film removal method forremoving a by-product of a plasma reaction.

Another objective of the present invention is to provide a film removalmethod for increasing the yield of liquid crystal panels.

Yet another objective of the present invention is to provide a filmremoval method for minimizing the manufacturing costs of liquid crystalpanels.

A further objective of the present invention is to provide a filmremoval method for removing a photoresist from a liquid crystal panelthoroughly.

In order to achieve the above and other objectives, the presentinvention discloses a film removal method for removing a film from asubstrate. The film removal method comprises the steps of disposing aplasma generator and a sucking apparatus above the substrate, adjustingthe plasma generator to allow the plasma generator to obliquely projecta plasma beam onto the film, disposing the sucking apparatus on areflection path of the plasma beam so as to suck a by-product of anincomplete plasma reaction occurring to the film, with a view to keepinga surface of the substrate clean.

In order to achieve the above and other objectives, the presentinvention also discloses a film removal apparatus for removing the filmfrom the substrate. The film removal apparatus comprises the plasmagenerator and the sucking apparatus. The plasma generator obliquelyprojects the plasma onto the film so as to remove the film from thesubstrate. The sucking apparatus is disposed on the reflection path ofthe plasma projected by the plasma generator and configured to suck theby-product of the incomplete plasma reaction occurring to the film, witha view to keeping the surface of the substrate clean.

The substrate is a liquid crystal panel while the film is a photoresist.In order to allow the plasma generator to remove the photoresist from aliquid crystal panel thoroughly, both the plasma generator and thesucking apparatus are oppositely rotated about a rotation axis andhorizontally moved in relation to the substrate. To be specific, theplasma generator and the sucking apparatus are enclosed by a casing andthereby rotated as a whole.

Unlike the prior art wherein plasma is perpendicularly projected ontothe substrate and thus a by-product of the plasma reaction deposits onthe substrate, the present invention discloses a film removal methodwhich involves obliquely projecting the plasma onto the film-coatedsubstrate, sucking the by-product which appears on a reflection path ofthe projected plasma, thus removing the by-product of the plasmareaction to a great extent.

The prior art which involves projecting the plasma perpendicularly ontothe substrate has a drawback, that is, it is difficult to remove aphotoresist from the lateral surfaces of the microstructures of a liquidcrystal panel. By contrast, the film removal method of the presentinvention involves projecting the plasma obliquely onto the substrate soas to remove the photoresist from the lateral surfaces of themicrostructures of a liquid crystal panel.

It is feasible to upwardly project the plasma to remove the photoresistfrom the liquid crystal panel such that the by-product of the plasmareaction drops spontaneously in accordance with the prior art.Nevertheless, the aforesaid process entails reversing the liquid crystalpanel and thereby incurs high costs. By contrast, the film removalapparatus of the present invention allows the liquid crystal panel tokeep passing through an assembly line in the same direction and therebyminimizes the manufacturing costs.

In short, the present invention discloses a method for film removal andan apparatus thereof for removing a by-product of a plasma reaction,thus increasing the yield of liquid crystal panels, and reducing themanufacturing costs.

Hence, the present invention has high industrial applicability.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B (PRIOR ART) are schematic views of a conventional methodwhich involves using atmospheric plasma as a surface cleansing means;

FIGS. 2A to 2C are schematic views illustrating a film removal method ofthe present invention;

FIG. 3 is a schematic view illustrating an embodiment of a film removalapparatus of the present invention; and

FIG. 4 is a schematic view illustrating another embodiment of a filmremoval apparatus of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The present invention is herein illustrated with specific embodiments,so that one skilled in the pertinent art can easily understand otheradvantages and effects of the present invention from the disclosure ofthe invention.

Referring to FIGS. 2A to 2C which are schematic views illustrating afilm removal method of the present invention.

As shown in FIG. 2A, the film removal method of the present invention isfor removing from a substrate 3 a film 30 disposed thereon. Thesubstrate 3 is a liquid crystal panel while the film 30 is a photoresistdisposed on the liquid crystal panel. As shown in FIG. 2B, a plasmagenerator 21 and a sucking apparatus 22 are disposed above the substrate3 first. Gases applicable to the plasma generator 21 are, namely cleandry air and gaseous N₂. Then, plasma is formed under ordinaryatmospheric conditions.

Afterward, adjusting the plasma generator 21 such that the plasmagenerator 21 obliquely projects a plasma beam 210 onto the film 30,disposing the sucking apparatus 22 on a reflection path of the plasmabeam 210 so as to suck a by-product 30′ of an incomplete reaction of thefilm 30 and the plasma beam 210 with a view to keeping a surface of thesubstrate 3 clean.

In order to allow the plasma generator 21 to remove a photoresist from aliquid crystal panel thoroughly, both the plasma generator 21 and thesucking apparatus 22 are oppositely rotated about a rotation axis andhorizontally moved in relation to the substrate 3. To be specific, boththe plasma generator 21 and the sucking apparatus 22 are enclosed by acasing 20 and thereby driven by a motor to rotate as a whole.

The substrate 3 is a liquid crystal panel and thereby comprises aplurality of microstructures 31. The front surfaces and the lateralsurfaces of the microstructures 31 are coated with the photoresist (thefilm 30). The film removal method of the present invention involvesobliquely projecting the plasma beam 210 onto the substrate 3 andthereby thoroughly removing the photoresist from the front surfaces andthe lateral surfaces of the microstructures 31.

As shown in FIG. 2C, the film removal method of the present inventionfurther involves disposing a reaction sensor 23 between the plasmagenerator 21 and the sucking apparatus 22 so as to detect whether thefilm 30 has already been thoroughly removed. As regards the detectionmechanism, the reaction sensor 23 detects whether formation of theby-product 30′ continues active, or detects for presence of traces ofthe substrate 3. Detection of inactive formation of the by-product 30′in an area indicates that the photoresist in the area has alreadyundergone a plasma reaction thoroughly, and that the by-product 30′ ofthe plasma reaction has already been thoroughly removed. Upon feedbackof a sensing signal, both the plasma generator 21 and the suckingapparatus 22 may be moved to another area to remove the photoresist.

Referring to FIG. 3, the present invention also discloses a film removalapparatus 2 for removing the film 30 from the substrate 3. The filmremoval apparatus 2 comprises the plasma generator 21 and the suckingapparatus 22. The plasma generator 21 obliquely projects the plasma beam210 onto the film 30 so as to remove the film 30 from the substrate 3.The sucking apparatus 22 is disposed on the reflection path of theplasma beam 210 projected by the plasma generator 21 so as to suck theby-product 30′ of the incomplete plasma reaction occurring to the film30 with a view to keeping the surface of the substrate 3 clean. The filmremoval apparatus 2 further comprises the reaction sensor 23 disposedbetween the plasma generator 21 and the sucking apparatus 22 andconfigured to detect whether the film 30 has already been thoroughlyremoved.

Referring to FIG. 4, the end of the plasma generator 21 is disposed witha plurality of jet channels 211 pointing in different directions forprojecting the plasma beam 210 in all directions. The sucking apparatus22 adjusts a slope thereof in response to the plasma beam 210 projectedby the jet channels in different directions. The sucking apparatus 22comprises a wide-mouthed end so as to suck the by-product 30′ to thefullest.

Unlike the prior art wherein plasma is perpendicularly projected onto asubstrate and thus a by-product of the plasma reaction deposits on thesubstrate, the present invention discloses a film removal method whichinvolves obliquely projecting the plasma onto the film-coated substrate,sucking the by-product which appears on a reflection path of theprojected plasma, thus removing the by-product of the plasma reaction toa great extent.

The prior art which involves projecting the plasma perpendicularly ontothe substrate has a drawback, that is, it is difficult to remove aphotoresist from the lateral surfaces of the microstructures of a liquidcrystal panel. By contrast, the film removal method of the presentinvention involves projecting the plasma obliquely onto the substrate soas to remove the photoresist from the lateral surfaces of themicrostructures of a liquid crystal panel.

It is feasible to upwardly project the plasma to remove the photoresistfrom the liquid crystal panel such that the by-product of the plasmareaction drops spontaneously in accordance with the prior art.Nevertheless, the aforesaid process entails reversing the liquid crystalpanel and thereby incurs high costs. By contrast, the film removalapparatus of the present invention allows the liquid crystal panel tokeep passing through an assembly line in the same direction and therebyminimizes the manufacturing costs.

In short, the present invention discloses a method for film removal andan apparatus thereof for removing a by-product of a plasma reaction,thus increasing the yield of liquid crystal panels, and reducing themanufacturing costs. Hence, the present invention has high industrialapplicability.

The aforesaid embodiments merely serve as the preferred embodiments ofthe present invention. They should not be construed as to limit thescope of the present invention in any way. Hence, any other changes canactually be made in the present invention. It will be apparent to thoseskilled in the art that all equivalent modifications or changes made,without departing from the spirit and the technical concepts disclosedby the present invention, should fall within the scope of the appendedclaims.

1. A film removal method for removing a film from a substrate,comprising the steps of: disposing a plasma generator and a suckingapparatus above the substrate; and adjusting the plasma generator so asto project a plasma beam from the plasma generator onto the filmobliquely, the plasma beam having a reflection path on which the suckingapparatus is disposed for sucking and removing a by-product of anincomplete plasma reaction occurring to the film so as to keep a surfaceof the substrate clean.
 2. The film removal method of claim 1, furthercomprising rotating the plasma generator and the sucking apparatus abouta rotation axis oppositely, and moving the plasma generator and thesucking apparatus horizontally in relation to the substrate.
 3. The filmremoval method of claim 1, wherein the substrate is a liquid crystalpanel while the film is a photoresist.
 4. The film removal method ofclaim 1, wherein besides the plasma generator and the sucking apparatus,a reaction sensor is disposed therebetween for determining if the filmhas been thoroughly removed.
 5. The film removal method of claim 4,wherein the reaction sensor detects for the by-product, detection ofabsence of the by-product indicates that the plasma reaction is done. 6.The film removal method of claim 4, wherein the reaction sensor detectsfor traces of the substrate, detection of presence of the traces of thesubstrate indicates that the plasma reaction is done. 7-18. (canceled)